Sensor & MEMS

Sensor & MEMS


Micro to Nano Solutions enables the development of high-performance sensors and MEMS devices through precision microfabrication and flexible process integration. Our platform is designed to support rapid prototyping, design iteration, and small-volume production for devices where mechanical integrity, dimensional accuracy, and material interfaces are critical.

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MEMS & Micro-Sensor Fabrication

We support a wide range of MEMS architectures, including surface-micromachined and bulk-micromachined devices. Our fabrication capabilities allow precise control of structural features, enabling reliable performance for mechanically and thermally sensitive components.

Typical sensor and MEMS applications include:

  • Pressure, inertial, and environmental sensors
  • Chemical and biological sensing platforms
  • Micro-actuators and mechanical transducers
  • Micro-optical and micro-fluidic structures

Through advanced UV lithography, e-beam lithography, thin-film deposition, and anisotropic dry and wet etching, we achieve accurate feature definition, alignment, and repeatability across wafers.

Process Integration & Device Optimization

Sensor and MEMS performance is highly dependent on process integration and material interactions. We work closely with clients to develop and refine fabrication flows that balance mechanical stress, film properties, and structural release requirements.

Our expertise includes:

  • Stress-engineered thin films and multilayer stacks
  • High aspect-ratio etching and cavity formation
  • Sacrificial layer processing and structural release
  • Wafer bonding and post-processing annealing

These capabilities allow us to optimize device sensitivity, reliability, and yield while supporting unconventional designs and novel material systems.

From Concept to Functional Devices

Micro to Nano Solutions specializes in small-lot, high-precision fabrication, making us an ideal partner for R&D-driven sensor and MEMS programs. From initial design support and process development to wafer-level fabrication and dicing, we provide a streamlined path from concept validation to functional devices.

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