At Micro to Nano Solutions, we enable the development of advanced semiconductor and photonic devices through flexible, design-driven micro- and nano-fabrication processes. Our capabilities support device architectures where electrical and optical functionalities are tightly integrated, addressing performance, scalability, and manufacturability requirements.

Semiconductor and photonic technologies form the foundation of modern computing, data transmission, sensing, and integrated optical systems. Fabricating these devices demands precise control over materials, interfaces, critical dimensions, and optical loss mechanisms—all of which are addressed through our end-to-end process integration approach.

Supported Semiconductor & Photonic Platforms

Our fabrication workflows are suitable for a wide range of material systems and device concepts, including:

• Silicon and compound semiconductor devices
• Integrated photonic circuits (PICs)
• On-chip waveguides, splitters, and couplers
• Optical interconnects and hybrid electro-optic devices
• Passive and active photonic components

These platforms are commonly used in high-speed data communication, sensing, signal processing, and emerging photonic computing architectures.

Semiconductor & Photonics Fabrication Flow

1.Design & Process Definition

Device layout, photonic routing, and process flow development with consideration of optical confinement, electrical routing, and alignment tolerances.

2.Lithography

UV photolithography for scalable device layers and alignment marks, combined with e-beam or direct-write lithography for high-resolution photonic features and critical dimensions.

3.Thin-Film Deposition

Deposition of semiconductor, dielectric, and metal layers using PECVD, LPCVD, sputtering, evaporation, or ALD to form optical cores, claddings, passivation layers, and electrical contacts.

4.Dry & Wet Etching

Anisotropic dry etching (RIE / ICP-RIE) for waveguide definition and semiconductor patterning, complemented by selective wet etching for material contrast and structural release where required.

5.Wafer-Level Processing & Integration

Wafer thinning, surface preparation, bonding, and multi-layer integration to enable complex photonic and semiconductor stacks.

6.Device Preparation & Metrology

Dicing, surface inspection, dimensional verification, and electrical/optical probing readiness for downstream testing and system integration.

Why Semiconductor & Photonics Matter

As electronic systems approach physical limits, photonics offers higher bandwidth, lower latency, and reduced power consumption. Semiconductor-based photonic integration enables compact, scalable solutions that bridge electronics and optics at the chip level.

By combining semiconductor-grade fabrication tools with photonics-focused process control, M2N Solutions helps clients:

• Validate new semiconductor-photonics architectures
• Reduce fabrication risk during early development
• Transition R&D concepts toward application-ready platforms

From standalone photonic components to integrated semiconductor-photonics systems, we support device fabrication that aligns performance with real-world deployment needs.