Micro to Nano Solutions provides specialized wet chemical processing for semiconductor, MEMS, and nanofabrication applications through certified cleanroom wet bench facilities. Our wet chemistry workflow supports both research-scale development and small production runs, enabling precise material preparation, surface modification, cleaning and etching with controlled process conditions.

Our wet benches are configured for acids, bases, solvents, and specialty chemistries, including RCA cleans, oxide removal, metal etching, and polymer stripping. Process development is performed following stringent cleanroom safety protocols with real-time monitoring and chemical handling standards equivalent to advanced semiconductor fabs.

Capabilities

• Wet etching of silicon, III-V, metals, and dielectrics
• RCA standard cleans
• HF oxide removal and controlled oxide thinning
• Piranha cleaning and resist stripping
• KOH / TMAH anisotropic silicon etching
• BOE etching (SiO₂ / SiN)
• Acetone/IPA solvent processing
• Wafer-level or chip-level handling

Typical Applications

• Semiconductor device fabrication
• MEMS and sensor processes
• Thin-film and surface preparation
• Post-lithography cleaning
• Failure-analysis sample preparation

Value

• Access to advanced academic cleanrooms with industry integration know-how
• Flexible chemistry workflows
• Accelerates research, prototyping, and technology transfer to manufacturable scale