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ETH Zurich Spinoff Secures $16M to Scale Physical AI


Switzerland-based robotics startup mimic has raised $16 million (~€13.9 million) in seed funding to deploy frontier physical AI for robots capable of handling complex, dexterous tasks in manufacturing and logistics. The round, led by Elaia with participation from Speedinvest and others,…

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What is wafer bonding technology?


Wafer bonding is a vital important technology in semiconductor manufacturing. It uses physical or chemical methods to bond two smooth and clean wafers together to achieve specific functions or assist in the semiconductor manufacturing process.   It is an technology…

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