We are pleased to announce that Micro to Nano Solutions (M2N) has significantly expanded its process capabilities with access to a new suite of advanced micro- and nano-fabrication tools.

This expansion enables us to support more complex device architectures, tighter process control, and a broader range of materials for both research and industrial applications.

Newly Available Equipment

• RIE (Reactive Ion Etching) – Oxford Instruments
  Chlorine-based chemistries currently under evaluation for compound semiconductors
• DRIE (Deep Reactive Ion Etching) – Oxford Instruments
• DRIE-ICP (Inductively Coupled Plasma Etching) – Plasmatherm
• ICP-CVD (Inductively Coupled Plasma Chemical Vapor Deposition) – Plasmatherm
• SRD (Spin Rinse Dryer)

Expanded Material & Process Capabilities

With these tools, M2N now offers enhanced processing across a wide range of materials:

Semiconductors

• Silicon (Si) – high-aspect-ratio DRIE (Bosch & cryogenic processes), surface texturing, and microstructuring
• Gallium Nitride (GaN) – chlorine-based dry etching for microLEDs, power devices, and photonics
• III-V materials (e.g., GaAs, InP) – anisotropic plasma etching (process development ongoing)

Dielectrics & Hard Substrates

• Sapphire (Al₂O₃) – ICP etching and substrate engineering for optical devices and microLEDs
• Silicon dioxide (SiO₂) & silicon nitride (Si₃N₄) – precision etching and pattern transfer

Metals

• Pattern transfer and etch process development for metals such as Al, Ti, Cr, Au (via plasma or hybrid approaches)

Thin Films & Deposition

• ICP-CVD deposition of dielectric layers (e.g., SiO₂, SiNx) with improved conformality and film quality
• Process tuning for stress control, refractive index engineering, and surface passivation

Application Areas

These enhanced capabilities support a wide range of applications:

• MicroLED and optoelectronic device fabrication
• MEMS and sensor development
• Photonic structures and micro-optics
• Semiconductor process development and prototyping
• Advanced packaging and surface engineering

Let’s Build What’s Next

With increased flexibility in etching and deposition, M2N is well-positioned to tackle complex fabrication challenges—from early-stage R&D to process optimization.

Have a project in mind? Reach out to discuss how we can support your next innovation.